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Small Signal Switching Diode
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Small Signal Zener Diode
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SiC Automotive
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Automotive Rectifier
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Protection Diode

Transient Voltage Suppressor
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ESD Protection Diode
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Thyristor
Uni-directional Thyristor Bi-directional Thyristor

Automotive Protection Diode
Transient Voltage Suppressor ESD Protection Diode Power Zener Diode

Small Signal

Small Signal Switching Diode
Small Signal Schottky Diode
Small Signal Zener Diode
Small Signal Transisitor
Small Signal Digital Transisitor
Power Transistor

Automotive Small Signal
Small Signal Switching Diode Small Signal Schottky Diode Small Signal Zener Diode Small Signal Transisitor Power Transistor Small Signal Digital Transisitor

MOSFET

ALL MOSFET
Automotive MOSFET

High-voltage MOSFET(500V-1000V)
SJ MOSFET SiC MOSFET Planner MOSFET

Low & Medium Voltage MOSFET(12V-400V)
N-Channel MOSFET P-Channel MOSFET

NP MOSFET(12V-300V)
Complementary MOSFET Dual N-Channel MOSFET Dual P-Channel MOSFET Half-bridge MOSFET

IGBT

IGBT Module
IGBT Discrete
IGBT Automotive

Module

Rectifier Diodes Module
Fast Recovery Module
Schottky Module
Thyristor Module
Thyristor / Rectifier Diode Module
Fast/Phase-controlled Thyristor

SiC

SiC Schottky Diode
SiC MOSFET
SiC Schottky Diode Modules
SiC MOSFET Modules
SiC Automotive Schottky Diode
SiC Automotive MOSFET

4/5″wafer

STD Chip
FRD Chip
EPI Chip
TVS Chip
HVB High Voltage Module Chip
Automotive Electronics Chip

6″wafer

TSBD Chip
PSBD Chip
FRED Chip
LBD Chip
PMBD Chip
ESD Chip

Integrated circuit

LOAD Switches
LDO
Shunt Regulator
DC-DC

Product Cross

CN EN

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SOD-323HE Diode for Automotive 、Home Appliances, Etc

SOD-323HE Diode for Automotive 、Home Appliances, Etc Back

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Introduction 1、With ultra-thin package shape, it can be used in miniaturized and thin circuits；
2、The bottom side of the package has a heat sink, which has excellent heat dissipation performance；
3、There are many kinds of packaging chips, including GPP, Schottky;
4、Products are widely used in secondary rectifier circuits, converters, freewheeling diodes, AC/DC power protection , etc.

Features 1、Excellent heat dissipation performance: the back pad has large area, good heat dissipation performance and strong flow capacity, which can meet the requirements of high-temperature applications
2、Thin package shape ：the package shape is thinner than SOD-123FL package and meets the development trend of packaging thinness

SPECIFICATION

FMG1AE THRU FMG1JE

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